We hope you are coming to SolidWorks World January 31-February 3 in
At ReverseEngineering.com we’re excited because we’ll introducing our new and enhanced product line of reverse engineering and inspection software at SolidWorks World 2010.
Beyond demonstrating our new products at SolidWorks World, we’ll also be giving an informative presentation on some interesting applications for our unique technologies. Also, if you come to SolidWorks World 2010, you’ll have a chance to participate in the Sony Handycam video camera giveaway.
At SolidWorks World, our presentation topics will include:
- A customer application success story
- Reverse engineering pumps that contain complex geometric parts
- ReverseEngineering.com’s unique "Model as you go Method"
- Point Cloud-to-Mesh-to-Surface inspection
- Q & A
Date, time, and place for our presentation are:
Certified Partner Theater in the Partner Pavilion
Monday, February 1, 2010
7:00 PM – 7:15 PM
In the Partner Pavilion we’ll be showing the newest version of our HighRES Integrated Point Processor (HIPP). HIPP 2010 is our flagship product that provides easy-to-use CAD-integrated reverse engineering capabilities and simplifies the traditional difficulties encountered between data collection hardware and point cloud management.
HIPP 2010 new features and capabilities are unmatched by our competition, regardless of cost. Here are just a few of the innovative features and capabilities that ReverseEngineering.com’s HIPP 2010 reverse engineering software offers:
- Solidworks Plug-in 2010 with multi threaded interface for seamless transition between the CMM digitizing hardware and SolidWorks mouse commands, including mouse gestures.
- HIPP 2010 advanced point cloud thinning for seamless integration to SolidWorks’ ScanTo3D capability.
- Draw and dimension as you go because of the interaction between ReverseEngineering.com software and SolidWorks , as well as our wide range of other supported CAD packages.
- Enhanced multi-threading that lets you use one thread for graphics and another thread for behind-the-scenes computation, so there are no resource conflicts between graphics and computational math functions.
- You can hot swap hard and laser probes while the HIPP is running. Advanced automatic probe compensation also lets you use any type of hard probe, as well as point probes with laser scanners.
- Compatibility with most major portable CMMs, including Faro, Romer, Metris, MicroScribe, 3D Creator, MicroScan, and others.
- HIPP 2010 has upgraded point cloud thinning and cleaning processes that ensure absolute integrity of processed data.
- New point cloud data file readers and translators let you import and thin large scan data sets. This process also strips out extraneous, unnecessary data (such as vectors and binary data that are not required or used by HighRES software). You just retain the data essential for creating 3D models in supported CAD packages.
- Compatibility with 64-bit computers, operating systems, and CAD software is coming soon that will let you take advantage of quad core CPU and virtually unlimited memory that will really accelerate your workflow!
If you are going to SolidWorks World this year, we hope to meet you there. Please, do stop by booth #200 and say “hello”! If you can’t attend SolidWorks World this year, don’t worry, there will be plenty of information, photos, and probably even video of the event. After the event we’ll be back with a series of tips and tricks for using our software products, including HIPP.
See you in
For More Information: ReverseEngineering.com
